esilicon.com FinFET ASICs, market-specific IP Platforms & 2.5D Packaging Solutions | eSilicon
FinFET ASICs, market-specific IP platforms & 2.5D packaging solutions for custom ICs for high-bandwidth networking, data center, AI/ML & 5G infrastructure
Keywords: hot chips, productization, eSilicon specializes in ASIC design, and manufacturing services, esilicon